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IEEE Transactions on Advanced Packaging : ウィキペディア英語版 | IEEE Transactions on Advanced Packaging
''IEEE Transactions on Advanced Packaging'' was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the ''Journal Citation Reports'', the journal had a 2010 impact factor of 1.276. == References ==
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