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・ Ieronim Uborevich
・ IEEE Signal Processing Society
・ IEEE Simon Ramo Medal
・ IEEE Smart Grid
・ IEEE Society on Social Implications of Technology
・ IEEE Software
・ IEEE Solid-State Circuits Society
・ IEEE Southwest Symposium on Image Analysis and Interpretation
・ IEEE Spectrum
・ IEEE Standards Association
・ IEEE style
・ IEEE Systems Council
・ IEEE Systems, Man, and Cybernetics Society
・ IEEE Technical Activities Board
・ IEEE Technology and Engineering Management Society
IEEE Transactions on Advanced Packaging
・ IEEE Transactions on Aerospace and Electronic Systems
・ IEEE Transactions on Antennas and Propagation
・ IEEE Transactions on Applied Superconductivity
・ IEEE Transactions on Communications
・ IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
・ IEEE Transactions on Computers
・ IEEE Transactions on Control Systems and Technology
・ IEEE Transactions on Education
・ IEEE Transactions on Electron Devices
・ IEEE Transactions on Evolutionary Computation
・ IEEE Transactions on Fuzzy Systems
・ IEEE Transactions on Information Forensics and Security
・ IEEE Transactions on Information Theory
・ IEEE Transactions on Magnetics


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IEEE Transactions on Advanced Packaging : ウィキペディア英語版
IEEE Transactions on Advanced Packaging

''IEEE Transactions on Advanced Packaging'' was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the ''Journal Citation Reports'', the journal had a 2010 impact factor of 1.276.
== References ==


抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
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